Keyword mems foundry services was used in the provided list of websites.
MEMS Foundry and Wafer Services - Rogue Valley Microhttp://pageoverview.com/website-report/roguevalleymicrodevices.com
Our 200mm precision MEMS Foundry specializes in MEMS device fabrication. Silicon Wafer Services include LPCVD Nitride, Oxide, Metal and Resist Spray Coat
- Expected expiration: July 1st in 2017
- Creation date: July 1st in 2014
- Renew date: May 16th in 2016
- Google Analytics: 32906993-11
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.http://pageoverview.com/website-report/theil.com
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
- Expected expiration: December 31st in 2021
- Creation date: January 1st in 1997
- Renew date: November 21st in 2012
- Google Analytics: 23981464-1
MEMS Foundry - MEMS Manufacturer & MEMS Development | Micralynehttp://pageoverview.com/website-report/micralyne.com
Micralyne is a world renowned manufacturer of microfabricated and MEMS products for communications, energy, life sciences and transportation markets.
- Expected expiration: April 4th in 2018
- Creation date: April 4th in 2000
- Renew date: April 11th in 2017
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.http://pageoverview.com/website-report/theil.com.tw
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
- Creation date: May 1st in 1997
- Expected expiration: May 31st in 2019
- Google Analytics: 23981464-1